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Fix EP radius and resync of LGA footprints #1910

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merged 2 commits into from
Jan 8, 2020

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poeschlr
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@poeschlr poeschlr commented Oct 10, 2019

Splitting #1821 into smaller bits. This one handles LGA footprints with the new EP radius.
I also included non EP footprint resyncronization in this pull request as this lib has only a few footprints generated with the script.
Script: pointhi/kicad-footprint-generator#422
Issue: #1798

For some reason one footprint is generated but does not exist in the lib:

  • Texas_SIL0010A_MicroSiP-10-1EP_3.8x3mm_P0.6mm_EP0.7x2.9mm.kicad_mod

@poeschlr poeschlr added Bug Fix footprint existing in the library Enhancement Improves existing footprint in the library Pending reviewer A pull request waiting for a reviewer labels Oct 10, 2019
@poeschlr poeschlr added this to the 5.1.5 milestone Oct 10, 2019
@evanshultz
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@poeschlr
The footprint not in the lib you mention above is not included here. I believe it is used by the Regulator_Switching:LMZM23601 symbol. Can you include it, either here or in another PR so we don't have a symbol referencing a missing footprint?

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Adding that footprint will require the yaml file to be double checked as we kind of have to assume that it was never checked (otherwise the footprint would be here.) Not sure how it happened that it is in the script but not the footprint repo.

@antoniovazquezblanco antoniovazquezblanco removed this from the 5.1.5 milestone Nov 18, 2019
@evanshultz
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The thermal vias version of this footprint is present in the lib now, but not the non-thermal vias version. And there is a symbol using the thermal vias footprint. I don't see this footprint included at https://github.com/pointhi/kicad-footprint-generator/blob/master/scripts/Packages/Package_NoLead__DFN_QFN_LGA_SON/size_definitions/lga.yaml, so maybe I just don't understand your point above. Why did you mention this footprint?

FYI, all footprints in the PR look fine to me so it's just the above stopping me from merging.

@evanshultz evanshultz self-assigned this Nov 18, 2019
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poeschlr commented Jan 3, 2020

The script always creates a non thermal via version, the thermal via version is the one that is optional. There must have been a reason why the non thermal via one was excluded when this was originally merged.

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@poeschlr
So would you add the missing footprint, in case someone wants to use the non-via version and as there's no reason to exclude it, and then I will merge? If you're accepting the thermal via version as-is I don't get why you require the YAML file to be checked to merge the non-via version.

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poeschlr commented Jan 5, 2020

See #2036

@evanshultz evanshultz merged commit 969ff5f into KiCad:master Jan 8, 2020
@antoniovazquezblanco antoniovazquezblanco removed the Pending reviewer A pull request waiting for a reviewer label Jan 9, 2020
@antoniovazquezblanco antoniovazquezblanco added this to the 5.1.6 milestone Jan 9, 2020
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