Rounded rectangles for exposed pads might have been a bad idea #1798
Description
The more i think about it the more i feel that the soldermask and copper layer for non soldermask defined exposed pad pads should both be normal rectangles. (Similarly the soldermask layer for soldermask defined pads)
What is the opinion of the rest of you? If i do not get any objections then i will update the generator script within a week or so and push the updated footprints to this repo.
edit reasoning:
the center pad is in most cases created equal to the nominal size of the package "lead". This means that even in nominal conditions there is possibly soldermask where the package has metal. (especially noticable for packages with small sizes.)
This is opposed to normal pads that leave space for a fillet and take lead tolerances into account.
See overlap of black (ep of package) and red (mask) in https://github.com/pointhi/kicad-footprint-generator/blob/fd49e97211c88b5d48f9339f3a73c646f24b1cd1/scripts/Packages/documentation/ep_handling.svg (the package pad is outside soldermask area even though soldermask is larger for this example)
Additionally: if paste is generated outside of vias (outer ring > 0) then there is even the possibility to get paste outside copper with the current generator.)
I will still keep rounded rectangles for solderpaste as IPC suggests that the solderpaste release from the stencil is improved by this.
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