Skip to content

Conversation

@mithro
Copy link
Contributor

@mithro mithro commented Jul 4, 2025

Summary

This PR adds two major documentation sections to enhance the wafer.space end user documentation:

  • Community Documentation Section - Framework for user-contributed content
  • Packaging Documentation Section - Comprehensive guide for chip packaging options
  • Updated Documentation Index - Integrates new sections into main navigation

Changes

Community Documentation

  • Created structure for unofficial, community-contributed content
  • Added comprehensive contribution guidelines and workflows
  • Set up organized directories for different content types:
    • Case studies and success stories
    • Tips, tricks, and troubleshooting guides
    • Custom workflows and best practices
  • Clearly marked as unofficial content with appropriate disclaimers

Packaging Documentation

  • Overview: Explains wafer.space bare die delivery and packaging responsibilities
  • Chip-on-Board Guide: Wire bonding techniques with references to Tiny Tapeout and OpenFASoC work
  • Bare Die Usage: Direct usage scenarios and considerations
  • Die Probing: Test tile design following SKY130 specifications adapted for GF180MCU
  • Decision Matrix: Helps users choose appropriate packaging approach

Documentation Structure

  • Updated main index to include new sections in logical order
  • Maintained existing useful resources section
  • Organized content for easy navigation and discovery

Test Plan

  • Verify all new documentation pages render correctly
  • Check internal links and cross-references work properly
  • Validate table of contents navigation
  • Review content accuracy and completeness
  • Test responsive design on mobile devices

🤖 Generated with Claude Code

@mithro
Copy link
Contributor Author

mithro commented Jul 4, 2025

Code Review for PR #1: Documentation Content

Overall Assessment

Excellent comprehensive documentation - This PR adds substantial value with well-structured community and packaging sections.

Strengths

  • Complete content structure with proper navigation
  • Professional writing quality throughout all sections
  • Real-world applicability - especially the COB packaging guide with actual cost estimates
  • Community focus with clear contribution guidelines
  • Proper MyST/Sphinx formatting with directives and cross-references

Issues Identified

High Priority

  1. Missing Makefile dependency management (CLAUDE.md:line 32-34)
    • References make setup and make install commands that don't exist in current Makefile
    • Should either implement these commands or remove references

Medium Priority

  1. packaging/bare-die-usage.md incomplete (packaging/index.md:line 55)

    • File referenced but content was truncated in diff
    • Need to verify this section is complete
  2. Cost estimates need validation (packaging/chip-on-board.md:line 219-224)

    • Table provides realistic ranges but should add disclaimer about variability
    • Consider adding "varies by complexity, location, and vendor" note

Low Priority

  1. Link verification needed
    • External links in useful-resources.md should be validated
    • Some GitHub links may become stale over time

Recommendations

  • Implement missing Makefile targets or update documentation references
  • Add glossary section to packaging documentation for technical terms
  • Consider adding examples of actual COB assemblies with photos

Security Review

✅ No security concerns identified - all external links are to reputable sources

Performance Impact

✅ Static documentation files - no performance impact

Overall recommendation: Approve after addressing the Makefile dependency issue

mithro and others added 4 commits July 4, 2025 15:01
- Create community section for unofficial, user-contributed content
- Add comprehensive contribution guidelines
- Set up directory structure for different content types:
  - Case studies, tips and tricks, workflows
  - Troubleshooting guides, success stories
- Clearly mark as unofficial community content with appropriate disclaimers

🤖 Generated with [Claude Code](https://claude.ai/code)

Co-Authored-By: Claude <noreply@anthropic.com>
- Create packaging section explaining wafer.space bare die delivery
- Add chip-on-board assembly guide with wire bonding techniques
- Include bare die usage documentation and die probing guide
- Reference Tiny Tapeout and OpenFASoC community work
- Cover SKY130 test tile specifications for GF180MCU adaptation
- Explain packaging options from easiest (COB) to traditional IC packaging

🤖 Generated with [Claude Code](https://claude.ai/code)

Co-Authored-By: Claude <noreply@anthropic.com>
- Add packaging section to table of contents
- Add community section to table of contents
- Organize sections in logical order: resources, packaging, community

🤖 Generated with [Claude Code](https://claude.ai/code)

Co-Authored-By: Claude <noreply@anthropic.com>
- Fix missing image reference in community/contributing.md
- Add comprehensive glossary to packaging documentation
- Enhance cost comparison table with realistic numbers and timelines
- Improve image organization guidelines for contributors

🤖 Generated with [Claude Code](https://claude.ai/code)

Co-Authored-By: Claude <noreply@anthropic.com>
@mithro mithro force-pushed the feature/documentation-content branch from 97ef63c to c897625 Compare July 4, 2025 22:01
@read-the-docs-community
Copy link

Documentation build overview

📚 wafer-space | 🛠️ build #28749328 (c897625) | 🔍 preview

Files changed

Comparing with latest (5f8d26f)

Show files (12) | 1 modified | 11 added | 0 deleted
File Status
index.html 📝 modified
community/contributing.html ➕ added
community/index.html ➕ added
packaging/chip-on-board.html ➕ added
packaging/index.html ➕ added
community/case-studies/index.html ➕ added
community/success-stories/index.html ➕ added
community/tips-and-tricks/index.html ➕ added
community/troubleshooting/index.html ➕ added
community/workflows/index.html ➕ added
packaging/using-bare-die/die-probing.html ➕ added
packaging/using-bare-die/index.html ➕ added

Sign up for free to join this conversation on GitHub. Already have an account? Sign in to comment

Labels

None yet

Projects

None yet

Development

Successfully merging this pull request may close these issues.

2 participants