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Xiaobao

Xiaobao (小包) is a miniaturized evaluation board for the Baochip-1x, forked from the original Dabao design. This board was initially developed during the MIT Residency at Seeed in January 2026.

The board uses the Seeed Studio XIAO form factor, making it compatible with the XIAO ecosystem of carrier boards and accessories.

Documentation

Go to xiaobao.samch.in for additional details.

About the Baochip-1x

The Baochip-1x is a mostly open-RTL, RISC-V microcontroller fabricated in TSMC 22nm:

Feature Specification
CPU Vexriscv RV32-IMAC @ 350 MHz
RAM 2 MB integrated SRAM
Storage 4 MB RRAM (non-volatile, similar to flash)
IO Accelerator Quad-core PicoRV32 @ 700 MHz
USB USB 2.0 High Speed with integrated PHY

Pinout

Xiaobao Pinout

This table provides the mapping between the digital labels on the XIAO module and the internal baochip1x peripheral functions.
Label Pin ID Name AF1 AF2 AF3 ANA/Power BIO
D0 G3 PA4 UARTTX_0 - - ADC0 -
D1 C4 PA5 - - - ADC1 -
D2 F6 PA6 - - - ADC2 -
D3 D2 PC14 - - - - 30
D4 C9 PB12 I2CSDA_0 - - - 12
D5 B9 PB11 I2CSCL_0 - - - 11
D6 E9 PB14 UARTTX_2 - - - 14
D7 D9 PB13 UARTRX_2 - - - 13
D8 F9 PC0 - SPMCLK_2 PWM_2[0] - 16
D9 H9 PC2 - SPMD1_2 PWM_2[2] - 18
D10 G9 PC1 - SPMD0_2 PWM_2[1] - 17
3V3 A3/H4 +3.3V - - - Power Rail -
GND F5/D4 GND - - - Ground -
5V - VBUS - - - Power Input -
D11 F4 PC6 - I2CSDA_3 - - 22
D12 E3 PC5 - I2CSCL_3 - - 21
D13 H8 PC3 - SPMCS0_2 PWM_2[3] - 19
D14 H3 PC9 - - - - 25
D15 H6 PC8 - - - - 24
D16 H7 PC7 - - - - 23
D19 C8 PB9 - - - - 9
D18 A9 PB1 - - PWM_1[1] - 1
D17 E8 PC4 - SPMCS1_2 - - 20

Resources

License

This project is licensed under the CERN Open Hardware License Version 2 - Weakly Reciprocal (CERN-OHL-W-2.0).

You can use, modify, and distribute the design (including commercially), but if you distribute modified hardware or design files, you must release those modifications under the same license.

Acknowledgments

Based on the Dabao evaluation board by Baochip.

Xiaobao vs Dabao

Xiaobao is a smaller form factor variant of the Dabao eval board. Key differences:

  • 6-layer PCB for higher routing density
  • More GPIO broken out despite smaller size
  • Onboard battery charging (LiPo)

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