FIX TC_DA_1_7 and update DCL mirror #26981
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- Fix TC_DA_1_7.py not to blow-up on bad PAAs, just log them. - Fix PAA fetcher to do the same Fixes project-chip#26979
- Fix NXP DER conversion --> not 100% legal format, but kept since only TC_DA_1_7.py library complains - Updated all from local run. Commands executed from root of SDK: ``` pip install click_option_group # somehow missing from requirements cd credentials/development python ../fetch-paa-certs-from-dcl.py --use-test-net-http cd ../production python ../fetch-paa-certs-from-dcl.py --use-main-net-http git add credentials/ ``` Fixes project-chip#26424
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PR #26981: Size comparison from d145bbb to 1df4c64 Increases (2 builds for bl602, bl702)
Full report (11 builds for bl602, bl702, cc32xx, linux, mbed, nrfconnect)
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andy31415
reviewed
May 31, 2023
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PR #26981: Size comparison from d145bbb to 83691e1 Increases (7 builds for cyw30739, psoc6, telink)
Decreases (10 builds for bl602, bl702, cc32xx, cyw30739, esp32, psoc6, telink)
Full report (56 builds for bl602, bl702, cc32xx, cyw30739, efr32, esp32, k32w, linux, mbed, nrfconnect, psoc6, telink)
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Commands run from root. Includes temporary NXP fixups ``` cd credentials/development rm dcld_mirror_* python ../fetch-paa-certs-from-dcl.py --use-test-net-http python ../fetch-paa-certs-from-dcl.py --use-main-net-http openssl x509 -inform pem -in paa-root-certs/dcld_mirror_SERIALNUMBER_63709330400001_CN_NXP_Matter_PAA_O_NXP_Semiconductors_NV_C_NL.pem -outform der -out paa-root-certs/dcld_mirror_SERIALNUMBER_63709330400001_CN_NXP_Matter_PAA_O_NXP_Semiconductors_NV_C_NL.der openssl x509 -inform pem -in paa-root-certs/dcld_mirror_SERIALNUMBER_63709380400001_CN_NXP_Matter_Test_PAA_O_NXP_Semiconductors_NV_C_NL.pem -outform der -out paa-root-certs/dcld_mirror_SERIALNUMBER_63709380400001_CN_NXP_Matter_Test_PAA_O_NXP_Semiconductors_NV_C_NL.der cd ../production rm dcld_mirror_* python ../fetch-paa-certs-from-dcl.py --use-main-net-http openssl x509 -inform pem -in paa-root-certs/dcld_mirror_SERIALNUMBER_63709330400001_CN_NXP_Matter_PAA_O_NXP_Semiconductors_NV_C_NL.pem -outform der -out paa-root-certs/dcld_mirror_SERIALNUMBER_63709330400001_CN_NXP_Matter_PAA_O_NXP_Semiconductors_NV_C_NL.der cd ../.. git add credentials ```
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PR #26981: Size comparison from d145bbb to 061fd09 Increases (9 builds for cyw30739, psoc6, telink)
Decreases (3 builds for bl602, telink)
Full report (56 builds for bl602, bl702, cc32xx, cyw30739, efr32, esp32, k32w, linux, mbed, nrfconnect, psoc6, telink)
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bzbarsky-apple
approved these changes
May 31, 2023
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PR #26981: Size comparison from d145bbb to 2c349bb Increases (8 builds for bl702, psoc6, telink)
Decreases (6 builds for cc32xx, k32w, psoc6, telink)
Full report (56 builds for bl602, bl702, cc32xx, cyw30739, efr32, esp32, k32w, linux, mbed, nrfconnect, psoc6, telink)
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andy31415
approved these changes
Jun 1, 2023
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Problem
Changes in PR
Fix TC_DA_1_7.py PAA parser
Update DCL mirror as of May 31, 2023
since only TC_DA_1_7.py library complains
Commands executed from root of SDK:
Testing done
Fixes #26424
Fixes #26979