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r0.1: fab: reduce paste pullback so copper and paste are 1:1
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ktemkin committed Dec 3, 2019
1 parent e20c2c2 commit ff24a6f
Showing 1 changed file with 7 additions and 8 deletions.
15 changes: 7 additions & 8 deletions hardware/rev0/luna_rev0.kicad_pcb
Original file line number Diff line number Diff line change
Expand Up @@ -18,7 +18,7 @@
(32 B.Adhes user hide)
(33 F.Adhes user hide)
(34 B.Paste user hide)
(35 F.Paste user hide)
(35 F.Paste user)
(36 B.SilkS user)
(37 F.SilkS user)
(38 B.Mask user hide)
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(pad_size 1.524 1.524)
(pad_drill 0.762)
(pad_to_mask_clearance 0.127)
(pad_to_paste_clearance_ratio -0.05)
(aux_axis_origin 0 0)
(visible_elements FEFDBEFF)
(pcbplotparams
(layerselection 0x010e8_80000001)
(layerselection 0x010fc_ffffffff)
(usegerberextensions true)
(usegerberattributes false)
(usegerberadvancedattributes false)
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(segment (start 132.848368 83.686632) (end 132.848368 83.693) (width 0.127) (layer B.Cu) (net 142))
(segment (start 133.096 83.439) (end 132.848368 83.686632) (width 0.127) (layer B.Cu) (net 142))

(zone (net 2) (net_name GND) (layer In1.Cu) (tstamp 5DDE038C) (hatch edge 0.508)
(zone (net 2) (net_name GND) (layer In1.Cu) (tstamp 5DE6C655) (hatch edge 0.508)
(connect_pads (clearance 0.254))
(min_thickness 0.254)
(fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
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)
)
)
(zone (net 1) (net_name +3V3) (layer In2.Cu) (tstamp 5DDE0389) (hatch edge 0.508)
(zone (net 1) (net_name +3V3) (layer In2.Cu) (tstamp 5DE6C652) (hatch edge 0.508)
(connect_pads (clearance 0.254))
(min_thickness 0.254)
(fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
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)
)
)
(zone (net 3) (net_name +1V8) (layer B.Cu) (tstamp 5DDE0386) (hatch edge 0.508)
(zone (net 3) (net_name +1V8) (layer B.Cu) (tstamp 5DE6C64F) (hatch edge 0.508)
(priority 10)
(connect_pads yes (clearance 0.254))
(min_thickness 0.254)
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)
)
)
(zone (net 6) (net_name +1V1) (layer B.Cu) (tstamp 5DDE0383) (hatch edge 0.508)
(zone (net 6) (net_name +1V1) (layer B.Cu) (tstamp 5DE6C64C) (hatch edge 0.508)
(priority 8)
(connect_pads thru_hole_only (clearance 0.254))
(min_thickness 0.254)
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)
)
)
(zone (net 4) (net_name +5V) (layer B.Cu) (tstamp 5DDE0380) (hatch edge 0.508)
(zone (net 4) (net_name +5V) (layer B.Cu) (tstamp 5DE6C649) (hatch edge 0.508)
(connect_pads (clearance 0.254))
(min_thickness 0.254)
(fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
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