Grounded CPW with Via Fence

[yuanshen-flexcompute]

Here's a notebook of a grounded CPW with via fence. Showcases lumped port excitation, resonance calculation over wide bandwidth (100GHz), and 3D waveguide. Final section compares data with paper results and agrees very well.

[github-actions]

Spell Check Report

GroundedCPWViaFence.ipynb:

Cell 1, Line 1: 'co-planar'
  > # Grounded co-planar waveguide with via fence
Cell 3, Line 1: 'Co-planar'
  > Co-planar waveguide (CPWs) transmission lines offer many advantages, including better EM shielding, ease of fabrication, and lower radiation loss when compared to microstrips. However, conventional CPWs can be susceptible to coupling to higher-order modes in nearby structures, thus introducing undesirable resonances that restrict the operating bandwidth of the CPW. In particular, at high frequencies, the side ground planes in a conventional CPW can support higher-order resonances that radiate similarly to a patch antenna.
Cell 3, Line 7: 'Arghya', 'Melde'
  > * Sain, Arghya, and Kathleen L. Melde, "Impact of ground via placement in grounded coplanar waveguide interconnects." IEEE Transactions on Components, Packaging and Manufacturing Technology 6.1 (2015): 136-144.
Cell 9, Line 18: 'longitudial'
  > vp = 287.3  # Via pitch (longitudial spacing)
Cell 17, Line 1: 'z-positions'
  > Then, we loop over all x- and z-positions to create the via fence.
Cell 18, Line 1: 'vias'
  > # create vias
Cell 33, Line 1: 'WavePort'
  > In general, we have a choice of using `WavePort` or `LumpedPort` to excite the structure. Because we are probing the resonances of this finite length CPW, it makes more sense to use the `LumpedPort`.
Cell 63, Line 3: 're-define'
  > We make use of the `updated_copy()` method to easily modify the structure list, without having to re-define from scratch the `Simulation` or `TerminalComponentModeler` objects.
Cell 91, Line 1: 'Arghya', 'Melde'
  > [1] Sain, Arghya, and Kathleen L. Melde, "Impact of ground via placement in grounded coplanar waveguide interconnects." IEEE Transactions on Components, Packaging and Manufacturing Technology 6.1 (2015): 136-144.

---

Checked 1 notebook(s). Found spelling errors in 1 file(s).
Generated by GitHub Action run: https://github.com/flexcompute/tidy3d-notebooks/actions/runs/16063139671