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Add 10-layer board stackup #101

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Merged
nasheed-x merged 1 commit into from
Nov 27, 2025
Merged

Add 10-layer board stackup #101

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101 changes: 100 additions & 1 deletion board_config.zen
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Original file line number Diff line number Diff line change
Expand Up @@ -309,21 +309,25 @@ def DefaultBoardConfig(
(4, CopperWeight("1oz")): BASE_4L_STACKUP,
(6, CopperWeight("1oz")): BASE_6L_STACKUP,
(8, CopperWeight("1oz")): BASE_8L_STACKUP,
(10, CopperWeight("1oz")): BASE_10L_STACKUP,
(2, CopperWeight("2oz")): BASE_2L_STACKUP, # TODO: Add 2oz stackup
(4, CopperWeight("2oz")): BASE_4L_2OZ_STACKUP,
(6, CopperWeight("2oz")): BASE_6L_STACKUP, # TODO: Add 2oz stackup
(8, CopperWeight("2oz")): BASE_8L_STACKUP, # TODO: Add 2oz stackup
(10, CopperWeight("2oz")): BASE_10L_STACKUP, # TODO: Add 2oz stackup
}.get((layers, outer_copper_weight))

netclasses = {
(2, CopperWeight("1oz")): BASE_2L_NETCLASSES,
(4, CopperWeight("1oz")): BASE_4L_NETCLASSES,
(6, CopperWeight("1oz")): BASE_6L_NETCLASSES,
(8, CopperWeight("1oz")): BASE_8L_NETCLASSES,
(10, CopperWeight("1oz")): BASE_10L_NETCLASSES,
(2, CopperWeight("2oz")): BASE_2L_NETCLASSES, # TODO: Add 2oz netclasses
(4, CopperWeight("2oz")): BASE_4L_2OZ_NETCLASSES,
(6, CopperWeight("2oz")): BASE_6L_NETCLASSES, # TODO: Add 2oz netclasses
(8, CopperWeight("2oz")): BASE_8L_NETCLASSES, # TODO: Add 2oz netclasses
(10, CopperWeight("2oz")): BASE_10L_NETCLASSES, # TODO: Add 2oz netclasses
}.get((layers, outer_copper_weight))

constraints = {
Expand Down Expand Up @@ -389,7 +393,7 @@ def Board(
name: Board configuration name
layout_path: Path to the board layout file (e.g., PCB file)
config: Complete BoardConfig object. If provided, layers and outer_copper_weight are ignored.
layers: Number of PCB layers (2, 4, 6, or 8). Required if config is not provided.
layers: Number of PCB layers (2, 4, 6, 8, or 10). Required if config is not provided.
outer_copper_weight: Outer copper weight ("1oz" or "2oz"). Default is "1oz".
Currently only 4-layer boards support 2oz outer copper.
track_widths: Additional track widths (in mm) to append to the base configuration.
Expand Down Expand Up @@ -509,6 +513,7 @@ BASE_PREPREG = Material(
# - 4L: Standard, L1 impedance-controlled
# - 6L: More routing, L1 + L6 impedance-controlled
# - 8L: High density, L1 + L6 (stripline) + L8 impedance-controlled
# - 10L: Very high density, L1 + L6 (stripline) + L10 impedance-controlled, extra power planes

# Common stackup configurations

Expand Down Expand Up @@ -803,6 +808,100 @@ BASE_8L_NETCLASSES = [
),
]

# Base 10-layer stackup (1.6mm, 1oz outer/0.5oz inner)
# SIG/GND/PWR/SIG/GND/SIG/GND/PWR/GND/SIG
#
# Layers:
# L1: Primary impedance-controlled (GCPW, ref L2, 0.1194mm coupling)
# L2: GND plane
# L3: PWR plane
# L4: Mixed signal
# L5: GND plane
# L6: Mixed signal (symmetric stripline)
# L7: GND plane
# L8: PWR plane
# L9: GND plane
# L10: Backup impedance-controlled (GCPW, ref L9, 0.1194mm coupling)
#
# Use: High-density routing with multiple power/ground planes. L1/L10 for high-speed,
# L6 symmetric stripline for sensitive signals with excellent EMI shielding.
BASE_10L_STACKUP = Stackup(
materials=[
FR4_CORE,
Material(
name="2116",
relative_permittivity=4.16,
loss_tangent=0.025,
),
],
thickness=1.6,
symmetric=True,
copper_finish="ENIG",
silk_screen_color="White",
solder_mask_color="Black",
layers=[
CopperLayer(thickness=0.035, role="mixed"), # L1 Top layer (1oz)
DielectricLayer(thickness=0.1194, material="2116", form="prepreg"),
CopperLayer(thickness=0.0152, role="ground"), # L2 (0.5oz)
DielectricLayer(thickness=0.2, material="FR4-Core", form="core"),
CopperLayer(thickness=0.0152, role="power"), # L3 (0.5oz)
DielectricLayer(thickness=0.1194, material="2116", form="prepreg"),
CopperLayer(thickness=0.0152, role="mixed"), # L4 (0.5oz)
DielectricLayer(thickness=0.2, material="FR4-Core", form="core"),
CopperLayer(thickness=0.0152, role="ground"), # L5 (0.5oz)
DielectricLayer(thickness=0.1194, material="2116", form="prepreg"),
CopperLayer(thickness=0.0152, role="mixed"), # L6 (0.5oz)
DielectricLayer(thickness=0.1194, material="2116", form="prepreg"),
CopperLayer(thickness=0.0152, role="ground"), # L7 (0.5oz)
DielectricLayer(thickness=0.2, material="FR4-Core", form="core"),
CopperLayer(thickness=0.0152, role="power"), # L8 (0.5oz)
DielectricLayer(thickness=0.1194, material="2116", form="prepreg"),
CopperLayer(thickness=0.0152, role="ground"), # L9 (0.5oz)
DielectricLayer(thickness=0.2, material="FR4-Core", form="core"),
CopperLayer(thickness=0.035, role="mixed"), # L10 Bottom layer (1oz)
],
)

# 10L Impedance-Controlled Netclasses (L1 GCPW, 0.1194mm dielectric, 0.2mm coplanar gap)
# Calculated using Sierra Circuits impedance calculator
BASE_10L_NETCLASSES = [
DEFAULT_NETCLASS,
NetClass(
name="50Ohm SE",
clearance=0.2,
track_width=0.175,
color="#0000C2FF",
single_ended_impedance=Impedance(50),
),
NetClass(
name="85Ohm Diff",
clearance=0.2,
track_width=0.16,
diff_pair_width=0.16,
diff_pair_gap=0.127,
color="#C200C2FF",
differential_pair_impedance=Impedance(85),
),
NetClass(
name="90Ohm Diff",
clearance=0.2,
track_width=0.14,
diff_pair_width=0.14,
diff_pair_gap=0.127,
color="#00C200FF",
differential_pair_impedance=Impedance(90),
),
NetClass(
name="100Ohm Diff",
clearance=0.2,
track_width=0.127,
diff_pair_width=0.127,
diff_pair_gap=0.18,
color="#C2C200FF",
differential_pair_impedance=Impedance(100),
),
]

# Common constraint sets for different fabrication capabilities

# Base PCB Constraints (1oz copper)
Expand Down