Merge pull request #83 from afaerber/tenstorrent

Categorize Tenstorrent as AI

README.md

@@ -237,7 +237,7 @@
 |[Syntiant](https://syntiant.com) | AI | 2017 | US |Neuromorphic processing for edge devices |
 |[Taalas](https://taalas.com) | AI | 2023 | CA |Platform for quickly turning any AI model into custom silicon |
 |[Tachyum](https://tachyum.com) | HPC | 2016 | US |High performance processor architecture |
-|[Tenstorrent](https://tenstorrent.com) | ASIC | 2016 | CA |AI processing devices |
+|[Tenstorrent](https://tenstorrent.com) | AI | 2016 | CA |AI processing devices |
 |[Teramount](https://teramount.com) | MFG | 2013 | IL |Packaging technology for photonic devices |
 |[Tetramem](https://tetramem.com) | AI | 2018 | US |AI accelerator for edge inference |
 |[Thintronics](https://thintronics.com) | MFG | 2019 | US |Thin film materials |

startups.csv

@@ -186,7 +186,7 @@ Synthara,synthara.ai,AI,CH,2020,In memory computation chips for AI
 Syntiant,syntiant.com,AI,US,2017,Neuromorphic processing for edge devices
 Taalas,taalas.com,AI,CA,2023,Platform for quickly turning any AI model into custom silicon
 Tachyum,tachyum.com,HPC,US,2016,High performance processor architecture
-Tenstorrent,tenstorrent.com,ASIC,CA,2016,AI processing devices
+Tenstorrent,tenstorrent.com,AI,CA,2016,AI processing devices
 Teramount,teramount.com,MFG,IL,2013,Packaging technology for photonic devices
 Tetramem,tetramem.com,AI,US,2018,AI accelerator for edge inference
 Thintronics,thintronics.com,MFG,US,2019,Thin film materials