This repository has been archived by the owner on Oct 2, 2020. It is now read-only.

Commits

History for

Commits on Sep 23, 2020

Use unique and IPC package sizes for R, L, and C (#2280 )
evanshultz
authored

Commits on Oct 6, 2019

new Tantalum packages from AVX F72 und F75 series (#1892 )

hvraven
authored and
poeschlr
committed

Commits on Jun 28, 2018

Fix some further mistakes for two terminal smd
poeschlr
committed

Commits on Jun 24, 2018

2 terminal smd chip: Pad equations where outdated
poeschlr
committed

Commits on Jun 13, 2018

Commits on Jun 11, 2018

Use rounded rectangle pads for two terminal chip parts
poeschlr
committed

Commits on Jun 7, 2018

Update two terminal smd chip packages to IPC-7351B
poeschlr
committed

Commits on Nov 29, 2017

Made naming of tantal caps easier to understand (Move letter code towards the back to avoid impression that these are manufacturer specific footprints)
poeschlr
committed

Commits on Nov 5, 2017

Adding tantal and led footprints.
poeschlr
committed

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