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EP now no longer uses rounded corners for copper
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@poeschlr
poeschlr committed Nov 8, 2019
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Showing 18 changed files with 45 additions and 45 deletions.
4 changes: 2 additions & 2 deletions Package_CSP.pretty/LFCSP-16-1EP_3x3mm_P0.5mm_EP1.6x1.6mm.kicad_mod
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@@ -1,4 +1,4 @@
(module LFCSP-16-1EP_3x3mm_P0.5mm_EP1.6x1.6mm (layer F.Cu) (tedit 5D9F7937)
(module LFCSP-16-1EP_3x3mm_P0.5mm_EP1.6x1.6mm (layer F.Cu) (tedit 5DC5F696)
(descr "LFCSP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-16/CP_16_22.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py")
(tags "LFCSP NoLead")
(attr smd)
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(pad 14 smd roundrect (at 0.25 -1.4375) (size 0.25 0.875) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 15 smd roundrect (at -0.25 -1.4375) (size 0.25 0.875) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 16 smd roundrect (at -0.75 -1.4375) (size 0.25 0.875) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 17 smd roundrect (at 0 0) (size 1.6 1.6) (layers F.Cu F.Mask) (roundrect_rratio 0.039062))
(pad 17 smd rect (at 0 0) (size 1.6 1.6) (layers F.Cu F.Mask))
(pad "" smd roundrect (at -0.4 -0.4) (size 0.64 0.64) (layers F.Paste) (roundrect_rratio 0.25))
(pad "" smd roundrect (at -0.4 0.4) (size 0.64 0.64) (layers F.Paste) (roundrect_rratio 0.25))
(pad "" smd roundrect (at 0.4 -0.4) (size 0.64 0.64) (layers F.Paste) (roundrect_rratio 0.25))
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6 changes: 3 additions & 3 deletions Package_CSP.pretty/LFCSP-16-1EP_3x3mm_P0.5mm_EP1.6x1.6mm_ThermalVias.kicad_mod
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@@ -1,4 +1,4 @@
(module LFCSP-16-1EP_3x3mm_P0.5mm_EP1.6x1.6mm_ThermalVias (layer F.Cu) (tedit 5D9F7937)
(module LFCSP-16-1EP_3x3mm_P0.5mm_EP1.6x1.6mm_ThermalVias (layer F.Cu) (tedit 5DC5F696)
(descr "LFCSP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-16/CP_16_22.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py")
(tags "LFCSP NoLead")
(attr smd)
Expand Down Expand Up @@ -40,12 +40,12 @@
(pad 14 smd roundrect (at 0.25 -1.4375) (size 0.25 0.875) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 15 smd roundrect (at -0.25 -1.4375) (size 0.25 0.875) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 16 smd roundrect (at -0.75 -1.4375) (size 0.25 0.875) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 17 smd roundrect (at 0 0) (size 1.6 1.6) (layers F.Cu F.Mask) (roundrect_rratio 0.039062))
(pad 17 smd rect (at 0 0) (size 1.6 1.6) (layers F.Cu F.Mask))
(pad 17 thru_hole circle (at -0.5 -0.5) (size 0.6 0.6) (drill 0.3) (layers *.Cu))
(pad 17 thru_hole circle (at 0.5 -0.5) (size 0.6 0.6) (drill 0.3) (layers *.Cu))
(pad 17 thru_hole circle (at -0.5 0.5) (size 0.6 0.6) (drill 0.3) (layers *.Cu))
(pad 17 thru_hole circle (at 0.5 0.5) (size 0.6 0.6) (drill 0.3) (layers *.Cu))
(pad 17 smd roundrect (at 0 0) (size 1.6 1.6) (layers B.Cu) (roundrect_rratio 0.039062))
(pad 17 smd rect (at 0 0) (size 1.6 1.6) (layers B.Cu))
(pad "" smd roundrect (at -0.4 -0.4) (size 0.69 0.69) (layers F.Paste) (roundrect_rratio 0.25))
(pad "" smd roundrect (at -0.4 0.4) (size 0.69 0.69) (layers F.Paste) (roundrect_rratio 0.25))
(pad "" smd roundrect (at 0.4 -0.4) (size 0.69 0.69) (layers F.Paste) (roundrect_rratio 0.25))
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4 changes: 2 additions & 2 deletions Package_CSP.pretty/LFCSP-16-1EP_3x3mm_P0.5mm_EP1.7x1.7mm.kicad_mod
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@@ -1,4 +1,4 @@
(module LFCSP-16-1EP_3x3mm_P0.5mm_EP1.7x1.7mm (layer F.Cu) (tedit 5D9F7937)
(module LFCSP-16-1EP_3x3mm_P0.5mm_EP1.7x1.7mm (layer F.Cu) (tedit 5DC5F696)
(descr "LFCSP, 16 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/HMC7992.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py")
(tags "LFCSP NoLead")
(attr smd)
Expand Down Expand Up @@ -40,7 +40,7 @@
(pad 14 smd roundrect (at 0.25 -1.5) (size 0.25 0.75) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 15 smd roundrect (at -0.25 -1.5) (size 0.25 0.75) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 16 smd roundrect (at -0.75 -1.5) (size 0.25 0.75) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 17 smd roundrect (at 0 0) (size 1.7 1.7) (layers F.Cu F.Mask) (roundrect_rratio 0.036765))
(pad 17 smd rect (at 0 0) (size 1.7 1.7) (layers F.Cu F.Mask))
(pad "" smd roundrect (at -0.425 -0.425) (size 0.69 0.69) (layers F.Paste) (roundrect_rratio 0.25))
(pad "" smd roundrect (at -0.425 0.425) (size 0.69 0.69) (layers F.Paste) (roundrect_rratio 0.25))
(pad "" smd roundrect (at 0.425 -0.425) (size 0.69 0.69) (layers F.Paste) (roundrect_rratio 0.25))
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6 changes: 3 additions & 3 deletions Package_CSP.pretty/LFCSP-16-1EP_3x3mm_P0.5mm_EP1.7x1.7mm_ThermalVias.kicad_mod
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Original file line number Diff line number Diff line change
@@ -1,4 +1,4 @@
(module LFCSP-16-1EP_3x3mm_P0.5mm_EP1.7x1.7mm_ThermalVias (layer F.Cu) (tedit 5D9F7937)
(module LFCSP-16-1EP_3x3mm_P0.5mm_EP1.7x1.7mm_ThermalVias (layer F.Cu) (tedit 5DC5F696)
(descr "LFCSP, 16 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/HMC7992.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py")
(tags "LFCSP NoLead")
(attr smd)
Expand Down Expand Up @@ -40,12 +40,12 @@
(pad 14 smd roundrect (at 0.25 -1.5) (size 0.25 0.75) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 15 smd roundrect (at -0.25 -1.5) (size 0.25 0.75) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 16 smd roundrect (at -0.75 -1.5) (size 0.25 0.75) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 17 smd roundrect (at 0 0) (size 1.7 1.7) (layers F.Cu F.Mask) (roundrect_rratio 0.036765))
(pad 17 smd rect (at 0 0) (size 1.7 1.7) (layers F.Cu F.Mask))
(pad 17 thru_hole circle (at -0.55 -0.55) (size 0.6 0.6) (drill 0.3) (layers *.Cu))
(pad 17 thru_hole circle (at 0.55 -0.55) (size 0.6 0.6) (drill 0.3) (layers *.Cu))
(pad 17 thru_hole circle (at -0.55 0.55) (size 0.6 0.6) (drill 0.3) (layers *.Cu))
(pad 17 thru_hole circle (at 0.55 0.55) (size 0.6 0.6) (drill 0.3) (layers *.Cu))
(pad 17 smd roundrect (at 0 0) (size 1.7 1.7) (layers B.Cu) (roundrect_rratio 0.036765))
(pad 17 smd rect (at 0 0) (size 1.7 1.7) (layers B.Cu))
(pad "" smd roundrect (at -0.425 -0.425) (size 0.74 0.74) (layers F.Paste) (roundrect_rratio 0.25))
(pad "" smd roundrect (at -0.425 0.425) (size 0.74 0.74) (layers F.Paste) (roundrect_rratio 0.25))
(pad "" smd roundrect (at 0.425 -0.425) (size 0.74 0.74) (layers F.Paste) (roundrect_rratio 0.25))
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4 changes: 2 additions & 2 deletions Package_CSP.pretty/LFCSP-16-1EP_4x4mm_P0.65mm_EP2.4x2.4mm.kicad_mod
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Original file line number Diff line number Diff line change
@@ -1,4 +1,4 @@
(module LFCSP-16-1EP_4x4mm_P0.65mm_EP2.4x2.4mm (layer F.Cu) (tedit 5D9F7937)
(module LFCSP-16-1EP_4x4mm_P0.65mm_EP2.4x2.4mm (layer F.Cu) (tedit 5DC5F696)
(descr "LFCSP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-16/cp-16-40.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py")
(tags "LFCSP NoLead")
(attr smd)
Expand Down Expand Up @@ -40,7 +40,7 @@
(pad 14 smd roundrect (at 0.325 -1.8875) (size 0.35 0.975) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 15 smd roundrect (at -0.325 -1.8875) (size 0.35 0.975) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 16 smd roundrect (at -0.975 -1.8875) (size 0.35 0.975) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 17 smd roundrect (at 0 0) (size 2.4 2.4) (layers F.Cu F.Mask) (roundrect_rratio 0.036458))
(pad 17 smd rect (at 0 0) (size 2.4 2.4) (layers F.Cu F.Mask))
(pad "" smd roundrect (at -0.6 -0.6) (size 0.97 0.97) (layers F.Paste) (roundrect_rratio 0.25))
(pad "" smd roundrect (at -0.6 0.6) (size 0.97 0.97) (layers F.Paste) (roundrect_rratio 0.25))
(pad "" smd roundrect (at 0.6 -0.6) (size 0.97 0.97) (layers F.Paste) (roundrect_rratio 0.25))
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6 changes: 3 additions & 3 deletions Package_CSP.pretty/LFCSP-16-1EP_4x4mm_P0.65mm_EP2.4x2.4mm_ThermalVias.kicad_mod
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Original file line number Diff line number Diff line change
@@ -1,4 +1,4 @@
(module LFCSP-16-1EP_4x4mm_P0.65mm_EP2.4x2.4mm_ThermalVias (layer F.Cu) (tedit 5D9F7937)
(module LFCSP-16-1EP_4x4mm_P0.65mm_EP2.4x2.4mm_ThermalVias (layer F.Cu) (tedit 5DC5F696)
(descr "LFCSP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-16/cp-16-40.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py")
(tags "LFCSP NoLead")
(attr smd)
Expand Down Expand Up @@ -40,7 +40,7 @@
(pad 14 smd roundrect (at 0.325 -1.8875) (size 0.35 0.975) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 15 smd roundrect (at -0.325 -1.8875) (size 0.35 0.975) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 16 smd roundrect (at -0.975 -1.8875) (size 0.35 0.975) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 17 smd roundrect (at 0 0) (size 2.4 2.4) (layers F.Cu F.Mask) (roundrect_rratio 0.036458))
(pad 17 smd rect (at 0 0) (size 2.4 2.4) (layers F.Cu F.Mask))
(pad 17 thru_hole circle (at -0.9 -0.9) (size 0.6 0.6) (drill 0.3) (layers *.Cu))
(pad 17 thru_hole circle (at 0 -0.9) (size 0.6 0.6) (drill 0.3) (layers *.Cu))
(pad 17 thru_hole circle (at 0.9 -0.9) (size 0.6 0.6) (drill 0.3) (layers *.Cu))
Expand All @@ -50,7 +50,7 @@
(pad 17 thru_hole circle (at -0.9 0.9) (size 0.6 0.6) (drill 0.3) (layers *.Cu))
(pad 17 thru_hole circle (at 0 0.9) (size 0.6 0.6) (drill 0.3) (layers *.Cu))
(pad 17 thru_hole circle (at 0.9 0.9) (size 0.6 0.6) (drill 0.3) (layers *.Cu))
(pad 17 smd roundrect (at 0 0) (size 2.4 2.4) (layers B.Cu) (roundrect_rratio 0.036458))
(pad 17 smd rect (at 0 0) (size 2.4 2.4) (layers B.Cu))
(pad "" smd roundrect (at -0.6 -0.6) (size 1.04 1.04) (layers F.Paste) (roundrect_rratio 0.240385))
(pad "" smd roundrect (at -0.6 0.6) (size 1.04 1.04) (layers F.Paste) (roundrect_rratio 0.240385))
(pad "" smd roundrect (at 0.6 -0.6) (size 1.04 1.04) (layers F.Paste) (roundrect_rratio 0.240385))
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4 changes: 2 additions & 2 deletions Package_CSP.pretty/LFCSP-20-1EP_4x4mm_P0.5mm_EP2.6x2.6mm.kicad_mod
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Original file line number Diff line number Diff line change
@@ -1,4 +1,4 @@
(module LFCSP-20-1EP_4x4mm_P0.5mm_EP2.6x2.6mm (layer F.Cu) (tedit 5D9F7937)
(module LFCSP-20-1EP_4x4mm_P0.5mm_EP2.6x2.6mm (layer F.Cu) (tedit 5DC5F696)
(descr "LFCSP, 20 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-20/CP_20_8.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py")
(tags "LFCSP NoLead")
(attr smd)
Expand Down Expand Up @@ -44,7 +44,7 @@
(pad 18 smd roundrect (at 0 -1.9375) (size 0.25 0.875) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 19 smd roundrect (at -0.5 -1.9375) (size 0.25 0.875) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 20 smd roundrect (at -1 -1.9375) (size 0.25 0.875) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 21 smd roundrect (at 0 0) (size 2.6 2.6) (layers F.Cu F.Mask) (roundrect_rratio 0.024038))
(pad 21 smd rect (at 0 0) (size 2.6 2.6) (layers F.Cu F.Mask))
(pad "" smd roundrect (at -0.65 -0.65) (size 1.05 1.05) (layers F.Paste) (roundrect_rratio 0.238095))
(pad "" smd roundrect (at -0.65 0.65) (size 1.05 1.05) (layers F.Paste) (roundrect_rratio 0.238095))
(pad "" smd roundrect (at 0.65 -0.65) (size 1.05 1.05) (layers F.Paste) (roundrect_rratio 0.238095))
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6 changes: 3 additions & 3 deletions Package_CSP.pretty/LFCSP-20-1EP_4x4mm_P0.5mm_EP2.6x2.6mm_ThermalVias.kicad_mod
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Original file line number Diff line number Diff line change
@@ -1,4 +1,4 @@
(module LFCSP-20-1EP_4x4mm_P0.5mm_EP2.6x2.6mm_ThermalVias (layer F.Cu) (tedit 5D9F7937)
(module LFCSP-20-1EP_4x4mm_P0.5mm_EP2.6x2.6mm_ThermalVias (layer F.Cu) (tedit 5DC5F696)
(descr "LFCSP, 20 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-20/CP_20_8.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py")
(tags "LFCSP NoLead")
(attr smd)
Expand Down Expand Up @@ -44,7 +44,7 @@
(pad 18 smd roundrect (at 0 -1.9375) (size 0.25 0.875) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 19 smd roundrect (at -0.5 -1.9375) (size 0.25 0.875) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 20 smd roundrect (at -1 -1.9375) (size 0.25 0.875) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 21 smd roundrect (at 0 0) (size 2.6 2.6) (layers F.Cu F.Mask) (roundrect_rratio 0.024038))
(pad 21 smd rect (at 0 0) (size 2.6 2.6) (layers F.Cu F.Mask))
(pad 21 thru_hole circle (at -1 -1) (size 0.6 0.6) (drill 0.3) (layers *.Cu))
(pad 21 thru_hole circle (at 0 -1) (size 0.6 0.6) (drill 0.3) (layers *.Cu))
(pad 21 thru_hole circle (at 1 -1) (size 0.6 0.6) (drill 0.3) (layers *.Cu))
Expand All @@ -54,7 +54,7 @@
(pad 21 thru_hole circle (at -1 1) (size 0.6 0.6) (drill 0.3) (layers *.Cu))
(pad 21 thru_hole circle (at 0 1) (size 0.6 0.6) (drill 0.3) (layers *.Cu))
(pad 21 thru_hole circle (at 1 1) (size 0.6 0.6) (drill 0.3) (layers *.Cu))
(pad 21 smd roundrect (at 0 0) (size 2.6 2.6) (layers B.Cu) (roundrect_rratio 0.024038))
(pad 21 smd rect (at 0 0) (size 2.6 2.6) (layers B.Cu))
(pad "" smd roundrect (at -0.65 -0.65) (size 1.09 1.09) (layers F.Paste) (roundrect_rratio 0.229358))
(pad "" smd roundrect (at -0.65 0.65) (size 1.09 1.09) (layers F.Paste) (roundrect_rratio 0.229358))
(pad "" smd roundrect (at 0.65 -0.65) (size 1.09 1.09) (layers F.Paste) (roundrect_rratio 0.229358))
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4 changes: 2 additions & 2 deletions Package_CSP.pretty/LFCSP-24-1EP_4x4mm_P0.5mm_EP2.5x2.5mm.kicad_mod
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Original file line number Diff line number Diff line change
@@ -1,4 +1,4 @@
(module LFCSP-24-1EP_4x4mm_P0.5mm_EP2.5x2.5mm (layer F.Cu) (tedit 5D9F792A)
(module LFCSP-24-1EP_4x4mm_P0.5mm_EP2.5x2.5mm (layer F.Cu) (tedit 5DC5F6A3)
(descr "LFCSP, 24 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_24_7.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py")
(tags "LFCSP NoLead")
(attr smd)
Expand Down Expand Up @@ -48,7 +48,7 @@
(pad 22 smd roundrect (at -0.25 -1.9375) (size 0.25 0.875) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 23 smd roundrect (at -0.75 -1.9375) (size 0.25 0.875) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 24 smd roundrect (at -1.25 -1.9375) (size 0.25 0.875) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 25 smd roundrect (at 0 0) (size 2.5 2.5) (layers F.Cu F.Mask) (roundrect_rratio 0.025))
(pad 25 smd rect (at 0 0) (size 2.5 2.5) (layers F.Cu F.Mask))
(pad "" smd roundrect (at -0.625 -0.625) (size 1.01 1.01) (layers F.Paste) (roundrect_rratio 0.247525))
(pad "" smd roundrect (at -0.625 0.625) (size 1.01 1.01) (layers F.Paste) (roundrect_rratio 0.247525))
(pad "" smd roundrect (at 0.625 -0.625) (size 1.01 1.01) (layers F.Paste) (roundrect_rratio 0.247525))
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6 changes: 3 additions & 3 deletions Package_CSP.pretty/LFCSP-24-1EP_4x4mm_P0.5mm_EP2.5x2.5mm_ThermalVias.kicad_mod
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Original file line number Diff line number Diff line change
@@ -1,4 +1,4 @@
(module LFCSP-24-1EP_4x4mm_P0.5mm_EP2.5x2.5mm_ThermalVias (layer F.Cu) (tedit 5D9F792A)
(module LFCSP-24-1EP_4x4mm_P0.5mm_EP2.5x2.5mm_ThermalVias (layer F.Cu) (tedit 5DC5F6A3)
(descr "LFCSP, 24 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_24_7.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py")
(tags "LFCSP NoLead")
(attr smd)
Expand Down Expand Up @@ -48,7 +48,7 @@
(pad 22 smd roundrect (at -0.25 -1.9375) (size 0.25 0.875) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 23 smd roundrect (at -0.75 -1.9375) (size 0.25 0.875) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 24 smd roundrect (at -1.25 -1.9375) (size 0.25 0.875) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 25 smd roundrect (at 0 0) (size 2.5 2.5) (layers F.Cu F.Mask) (roundrect_rratio 0.025))
(pad 25 smd rect (at 0 0) (size 2.5 2.5) (layers F.Cu F.Mask))
(pad 25 thru_hole circle (at -1 -1) (size 0.5 0.5) (drill 0.2) (layers *.Cu))
(pad 25 thru_hole circle (at 0 -1) (size 0.5 0.5) (drill 0.2) (layers *.Cu))
(pad 25 thru_hole circle (at 1 -1) (size 0.5 0.5) (drill 0.2) (layers *.Cu))
Expand All @@ -58,7 +58,7 @@
(pad 25 thru_hole circle (at -1 1) (size 0.5 0.5) (drill 0.2) (layers *.Cu))
(pad 25 thru_hole circle (at 0 1) (size 0.5 0.5) (drill 0.2) (layers *.Cu))
(pad 25 thru_hole circle (at 1 1) (size 0.5 0.5) (drill 0.2) (layers *.Cu))
(pad 25 smd roundrect (at 0 0) (size 2.5 2.5) (layers B.Cu) (roundrect_rratio 0.025))
(pad 25 smd rect (at 0 0) (size 2.5 2.5) (layers B.Cu))
(pad "" smd roundrect (at -0.625 -0.625) (size 1.08 1.08) (layers F.Paste) (roundrect_rratio 0.231481))
(pad "" smd roundrect (at -0.625 0.625) (size 1.08 1.08) (layers F.Paste) (roundrect_rratio 0.231481))
(pad "" smd roundrect (at 0.625 -0.625) (size 1.08 1.08) (layers F.Paste) (roundrect_rratio 0.231481))
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4 changes: 2 additions & 2 deletions Package_CSP.pretty/LFCSP-32-1EP_5x5mm_P0.5mm_EP3.1x3.1mm.kicad_mod
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Original file line number Diff line number Diff line change
@@ -1,4 +1,4 @@
(module LFCSP-32-1EP_5x5mm_P0.5mm_EP3.1x3.1mm (layer F.Cu) (tedit 5D9F7936)
(module LFCSP-32-1EP_5x5mm_P0.5mm_EP3.1x3.1mm (layer F.Cu) (tedit 5DC5F695)
(descr "LFCSP, 32 Pin (https://www.analog.com/media/en/package-pcb-resources/package/414143737956480539664569cp_32_2.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py")
(tags "LFCSP NoLead")
(attr smd)
Expand Down Expand Up @@ -56,7 +56,7 @@
(pad 30 smd roundrect (at -0.75 -2.4375) (size 0.25 0.825) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 31 smd roundrect (at -1.25 -2.4375) (size 0.25 0.825) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 32 smd roundrect (at -1.75 -2.4375) (size 0.25 0.825) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 33 smd roundrect (at 0 0) (size 3.1 3.1) (layers F.Cu F.Mask) (roundrect_rratio 0.020161))
(pad 33 smd rect (at 0 0) (size 3.1 3.1) (layers F.Cu F.Mask))
(pad "" smd roundrect (at -1.03 -1.03) (size 0.83 0.83) (layers F.Paste) (roundrect_rratio 0.25))
(pad "" smd roundrect (at -1.03 0) (size 0.83 0.83) (layers F.Paste) (roundrect_rratio 0.25))
(pad "" smd roundrect (at -1.03 1.03) (size 0.83 0.83) (layers F.Paste) (roundrect_rratio 0.25))
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6 changes: 3 additions & 3 deletions Package_CSP.pretty/LFCSP-32-1EP_5x5mm_P0.5mm_EP3.1x3.1mm_ThermalVias.kicad_mod
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Original file line number Diff line number Diff line change
@@ -1,4 +1,4 @@
(module LFCSP-32-1EP_5x5mm_P0.5mm_EP3.1x3.1mm_ThermalVias (layer F.Cu) (tedit 5D9F7936)
(module LFCSP-32-1EP_5x5mm_P0.5mm_EP3.1x3.1mm_ThermalVias (layer F.Cu) (tedit 5DC5F695)
(descr "LFCSP, 32 Pin (https://www.analog.com/media/en/package-pcb-resources/package/414143737956480539664569cp_32_2.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py")
(tags "LFCSP NoLead")
(attr smd)
Expand Down Expand Up @@ -56,7 +56,7 @@
(pad 30 smd roundrect (at -0.75 -2.4375) (size 0.25 0.825) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 31 smd roundrect (at -1.25 -2.4375) (size 0.25 0.825) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 32 smd roundrect (at -1.75 -2.4375) (size 0.25 0.825) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 33 smd roundrect (at 0 0) (size 3.1 3.1) (layers F.Cu F.Mask) (roundrect_rratio 0.020161))
(pad 33 smd rect (at 0 0) (size 3.1 3.1) (layers F.Cu F.Mask))
(pad 33 thru_hole circle (at -1.3 -1.3) (size 0.5 0.5) (drill 0.2) (layers *.Cu))
(pad 33 thru_hole circle (at -0.433333 -1.3) (size 0.5 0.5) (drill 0.2) (layers *.Cu))
(pad 33 thru_hole circle (at 0.433333 -1.3) (size 0.5 0.5) (drill 0.2) (layers *.Cu))
Expand All @@ -73,7 +73,7 @@
(pad 33 thru_hole circle (at -0.433333 1.3) (size 0.5 0.5) (drill 0.2) (layers *.Cu))
(pad 33 thru_hole circle (at 0.433333 1.3) (size 0.5 0.5) (drill 0.2) (layers *.Cu))
(pad 33 thru_hole circle (at 1.3 1.3) (size 0.5 0.5) (drill 0.2) (layers *.Cu))
(pad 33 smd roundrect (at 0 0) (size 3.1 3.1) (layers B.Cu) (roundrect_rratio 0.020161))
(pad 33 smd rect (at 0 0) (size 3.1 3.1) (layers B.Cu))
(pad "" smd custom (at -0.866667 -0.866667) (size 0.656835 0.656835) (layers F.Paste)
(options (clearance outline) (anchor circle))
(primitives
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4 changes: 2 additions & 2 deletions Package_CSP.pretty/LFCSP-48-1EP_7x7mm_P0.5mm_EP4.1x4.1mm.kicad_mod
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Original file line number Diff line number Diff line change
@@ -1,4 +1,4 @@
(module LFCSP-48-1EP_7x7mm_P0.5mm_EP4.1x4.1mm (layer F.Cu) (tedit 5D9F7936)
(module LFCSP-48-1EP_7x7mm_P0.5mm_EP4.1x4.1mm (layer F.Cu) (tedit 5DC5F695)
(descr "LFCSP, 48 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_48_5.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py")
(tags "LFCSP NoLead")
(attr smd)
Expand Down Expand Up @@ -72,7 +72,7 @@
(pad 46 smd roundrect (at -1.75 -3.45) (size 0.25 0.8) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 47 smd roundrect (at -2.25 -3.45) (size 0.25 0.8) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 48 smd roundrect (at -2.75 -3.45) (size 0.25 0.8) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 49 smd roundrect (at 0 0) (size 4.1 4.1) (layers F.Cu F.Mask) (roundrect_rratio 0.015244))
(pad 49 smd rect (at 0 0) (size 4.1 4.1) (layers F.Cu F.Mask))
(pad "" smd roundrect (at -1.37 -1.37) (size 1.1 1.1) (layers F.Paste) (roundrect_rratio 0.227273))
(pad "" smd roundrect (at -1.37 0) (size 1.1 1.1) (layers F.Paste) (roundrect_rratio 0.227273))
(pad "" smd roundrect (at -1.37 1.37) (size 1.1 1.1) (layers F.Paste) (roundrect_rratio 0.227273))
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