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BTSDK - CYW30739

Overview

The Infineon AIROC™ CYW30739 is an ultra-low-power multi-protocol system on chip. It has a stand-alone baseband processor with an integrated 2.4 GHz transceiver supporting Bluetooth® LE and Matter over Thread.

SDK Software Features

  • Matter over Thread support
  • Bluetooth® stack and profile level APIs for embedded Bluetooth® LE application development.
  • AIROC™ HCI protocol to simplify host/MCU application development.
  • APIs and drivers to access on board peripherals.
  • Support for Over-The-Air (OTA) upgrade.
  • Device Configurator for creating custom pin mapping.
  • Bluetooth® Configurator for creating LE GATT Database.
  • Documentation for APIs, datasheet, profiles, and features.

Kits Supported

CYW930739M2EVB-01:

  • 40-QFN AIROC™ CYW30739 multi-protocol SoC with external 8TR8211C Low Noise Amplifier and Power Amplifier (eLNA/ePA), ambient light sensor, thermistor, footprint for Infineon digital microphone, user switches and LEDs, and a USB connector for power, programming, and USB-UART bridge.
    Max UART baud rate is 3M

CYW930739M2EVB-02:

  • 134-WLCSP AIROC™ CYW30739 multi-protocol SoC with external 8TR8211C Low Noise Amplifier and Power Amplifier (eLNA/ePA), ambient light sensor, thermistor, footprint for Infineon digital microphone, on board serial flash, user switches and LEDs, and a USB connector for power, programming, and USB-UART bridge.
    Max UART baud rate is 3M

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