Thermal pads on motor drivers have thermal reliefs

[dan-gies]

Version Number

REV05

Bugfix or Enhancement

Bugfix

Description

The thermal pads on the motor driver ICs have thermal reliefs on their thermal pads on the top and bottom layers. This impedes thermal dissipation.

Suggested Solution

To get the best thermal transfer possible, this thermal pad must be direct-connected to the GND copper pours. Otherwise, the part risks overheating.