In this repository, you can find various data pipelines, written in Jayvee, to make open data sets from the material science domain easier, reliable and fun to use. See the latest releases for downloadable data sets.
All models can be found in the ./src/models/
directory and include a README.md
file. For example, for data about yield strength and grain size, have a look at src/models/yield-strength-grain-size
:
To run the model, install the Jayvee interpreter (see the Jayvee docs) and execute jv -d src/models/yield-strength-grain-size/model.jv
.
You can find an example use of the produced data in example-materials-science-data-report.ipynb.
Data Set | Infos | Jayvee Model |
---|---|---|
battery-materials | README.md | model.jv |
refractive-indices-dielectric-constants | README.md | model.jv |
semiconductor-band-gaps | README.md | model.jv |
thermoelectric-materials | README.md | model.jv |
thermoelectric-materials-system-identified-material-representation | README.md | model.jv |
yield-strength-grain-size | README.md | model.jv |
Jayvee is a domain-specific language to make the creation of data pipelines more accessible, developed by the JValue team from the Professorship for Open-Source Software at the Friedrich-Alexander-Universität Erlangen-Nürnberg. Jayvee is open source and can be found at https://jvalue.github.io/jayvee/.
The Software Campus is an accelerator for leadership talents providing funding and mentorship for doctoral students in computer science to complete a research project with an industry partner.
The data pipelines in this repository were created as part of the Software Campus project 'JValue-OCDE-Case1'. The project was lead by Philip Heltweg (https://heltweg.org) in cooperation with Springer Materials, a company of Holtzbrinck Publishing Group.
This research has been partially funded by the German Federal Ministry of Education and Research (BMBF) through grant 01IS17045 Software Campus 2.0 (Friedrich-Alexander-Universität Erlangen-Nürnberg) as part of the Software Campus project 'JValue-OCDE-Case1'. Responsibility for the content of this publication lies with the authors.